n time lag thin flm chip fuse for overcurrent protection n 3216 (eia 1206) miniature footprint n surface mount packaging for automated assembly n ul listed (ul 248-14) n rohs compliant* and halogen free** electrical characteristics sf-1206sp series - time lag surface mount fuses *** resistance value measured with less than 10 % of rated current. resistance tolerance 25 %. ****typical i 2 t value measured at 10x rated current. reliability testing model rated current (amps) fusing time resistance (m) typ.*** rated voltage breaking capacity typical i 2 t (a 2 s) **** sf-1206sp050 0.50 open within 1~120 sec. at 200 % rated current 738.5 dc 63 v dc 63 v 50 a 0.027 sf-1206sp080 0.80 215 0.072 sf-1206sp100 1.00 163.5 0.134 sf-1206sp125 1.25 100 0.233 sf-1206sp150 1.50 68.5 0.305 sf-1206sp200 2.00 48.5 0.509 sf-1206sp250 2.50 35 dc 32 v dc 32 v 50 a 0.777 sf-1206sp300 3.00 27 1.285 SF-1206SP400 4.00 14 2.374 sf-1206sp500 5.00 11 5.510 sf-1206sp700 7.00 7.5 10.170 singlfuse ? sf-1206sp series features *rohs compliant lead free *rohs compliant versions available lead free versions are rohs compliant* * rohs directive 2015/863, mar 31, 2015 and annex. ** bourns considers a product to be halogen free if (a) the bromine (br) content is 900 ppm or less; (b) the chlorine (cl) content is 900 ppm or less; and (c) the total bromine (br) and chlorine (cl) content is 1500 ppm or less. singlfuse is a trademark of bourns, inc. specifcations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. users should verify actual device performance in their specifc applications. parameter requirement test method carrying capacity ..................................... no fusing .................................................... rated current, 4 hours fusing time .............................................. within 120 seconds .................................... 200 % of its rated current interrupting ability ..................................... no mechanical damages ........................... after the fuse is interrupted, rated voltage applied for 30 seconds again bending test ............................................. no mechanical damages ........................... distance between holding points: 90 mm, bending: 3 mm, 1 time, 30 seconds resistance to solder heat ........................ 20 % ......................................................... 260 c 5 c,10 seconds 1 second solderability .............................................. 95 % coverage minimum ........................... 235 c 5 c, 2 0.5 second 245 c 5 c, 2 0.5 second (lead free) temperature rise ..................................... <75 c ........................................................ 100 % of its rated current, measure of surface temperature resistance to dry heat ............................. 20 % ......................................................... 105 c 5 c,1000 hours resistance to solvent ............................... no evident damage on protective .............. 23 c 5 c of isopropyl alcohol, 90 seconds coating and marking residual resistance ................................. 10k ohms or more ...................................... measure dc resistance after fusing thermal shock ......................................... dr < 10 % .................................................. -20 c / +25 c /+125 c /+25 c, 10 cycles ul file number ......................................... e198545 http://www.ul.com/ follow link to online certifcates directory , then enter ul file no. e198545, or click here operating temperature .................................................................................. -20 c to +105 c storage conditions temperature ................................................................................................ +5 c to +35 c humidity........................................................................................................... 40 % to 75 % shelf life ........................................................................... 2 years from manufacturing date moisture sensitivity level ........................................................................................................ 1 esd classifcation (hbm) .............................................................................................. class 6 environmental characteristics asia-pacifc: tel: +886-2 2562-4117 email: asiacus@bourns.com europe: tel: +36 88 520 390 email: eurocus@bourns.com the americas: tel: +1-951 781-5500 email: americus@bourns.com www.bourns.com
n portable memory n lcd monitors n disk drives n pdas n digital cameras n dvds n cell phones n rechargeable battery packs n battery chargers n set top boxes n industrial controllers sf-1206sp series - time lag surface mount fuses solder refow recommendations peak: 250 +0/-5 c 230 c or higher pre-heating zone soldering zone heating time 180 c peak: 250 +0/-5 c, 5 seconds pre-heating zone: 150 to 180 c, 90 30 seconds soldering zone: 230 c or higher, 30 10 seconds 250 200 150 temperature (c) 100 50 150 c 90 30 seconds 30 10 seconds singlfuse ? sf-1206sp series applications specifcations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. users should verify actual device performance in their specifc applications. product dimensions recommended pad layout dimensions: mm (inches) packaging: 5,000 pcs./reel 3.1 0.1 (.122 .004) 0.5 0.3 (.020 .012) 0.5 0.3 (.020 .012) 2.03 (.080) 0.5 0.2 (.020 .008) 0.5 0.2 (.020 .008) 0.6 0.1 (.024 .004) 1.55 0.1 (.061 .004) 3.81 (.150) 1.27 (.050) 3.1 0.1 (.122 .004) 0.5 0.3 (.020 .012) 0.5 0.3 (.020 .012) 2.03 (.080) 0.5 0.2 (.020 .008) 0.5 0.2 (.020 .008) 0.6 0.1 (.024 .004) 1.55 0.1 (.061 .004) 3.81 (.150) 1.27 (.050) 3.1 0.1 (.122 .004) 0.5 0.3 (.020 .012) 0.5 0.3 (.020 .012) 1.65 0.15 (.065 .006) 0.5 0.2 (.020 .008) 0.5 0.2 (.020 .008) 0.6 0.1 (.024 .004) 1.55 0.1 (.061 .004) 4.7 0.3 (.185 .012) 2.2 0.2 (.087 .008) typical part marking represents total content. layout may vary. how to order sf - 1206 sp 050 - 2 singlfuse? product designator smd footprint 3216 (eia 1206) size fuse blow type sp = time lag rated current 050-700 (500 ma - 7.00 a) packaging type - 2 = tape & reel (5,000 pcs./reel) rated current (a) f = 0.50 k = 0.80 l = 1.00 m = 1.25 p = 1.50 s = 2.00 t = 2.50 3 = 3.00 w = 4.00 y = 5.00 z = 7.00 construction & material content overcoat sn plat ing ceramic substrate fuse element cu / ni plating
sf-1206sp series - time lag surface mount fuses average time current curves minimum i 2 t v clear time curves rev. c 10/17 specifcations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. users should verify actual device performance in their specifc applications. thermal derating curve 120 110 100 90 80 -20 02 04 0 ambient temperature (c) percent of rating (%) 60 80 100 120 10 0 0. 1 1 10 0.01 0.001 0. 1 1 10 current (a ) 10 0 clearing time (s ) 1.0 a 1.25 a 1.5 a 0.8 a 0.5 a 2.5 a 2.0 a 3.0 a 4.0 a 5.0 a 7.0 a 10 0 0. 1 1 10 0.01 0.001 0.001 0.01 0.1 1 clearing time (s ) joule integral (a 2 sec) 4.00 a 3.00 a 2.50 a 2.00 a 1.00 a 1.25 a 1.50 a 0.80 a 0.50 a 7.00 a 5.00 a
sf-1206sp series tape and reel specifcations sf-1206sp series tape dimensions per eia 481-2 w 8.0 0.2 (.315 .008) p 0 4.0 0.1 (.157 .004) p 1 4.0 0.1 (.157 .004) p 2 2.0 0.05 (.079 .002) a 2.0 0.15 (.079 .006) b 3.6 0.2 (.142 .008) f 3.5 0.05 (.138 .002) e 1.75 0.1 (.069 .004) d 0 1.5 + 0.1/-0 (.059 + .004/-0) t 0.84 0.1 (.033 .004) reel dimensions a 178 0.2 (7.087 .079) b min. 60.0 1.0 (2.362 .039) c 13.0 1.0 (.512 .039) w 9.0 1.0 (.354 .039) t 11.4 2.0 (.449 .079) p o e w direction of unreeling f d o a w t c dia. b dia. a dia. b t top ta pe bottom tape pa per ta pe resistor tape p 2 p 1 dimensions: mm (inches) specifcations are subject to change without notice. the device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. users should verify actual device performance in their specifc applications.
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